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Articles (22)
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1

Systemic banking crisis early warning systems using dynamic Bayesian networks

Dabrowski, Joel Janek, Beyers, Conrad, de Villiers, Johan Pieter

Journal:

Expert Systems with Applications

Année:

2016

Langue:

english

Fichier:

PDF, 1.48 MB

english, 2016

2

[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - A Unique Temporary Bond Solution Based on a Polymeric Material Tacky at Room Temperature and Highly Thermally Resistant Application Extension from 3D-SIC to FO-WLP

Phommahaxay, Alain, Potoms, Goedele, Bertheau, Julien, Bex, Pieter, Duval, Fabrice, Podpod, Arnita, Wang, Teng, Verbinnen, Greet, Beyer, Gerald, Sleeckx, Erik, Beyne, Eric, Nakamura, Atsushi, Kamochi,

Année:

2017

Langue:

english

Fichier:

PDF, 1.90 MB

english, 2017

3

Bleeding complications during anticoagulant treatment in patients with cancer

Kamphuisen, Pieter W., Beyer-Westendorf, Jan

Journal:

Thrombosis Research

Année:

2014

Langue:

english

Fichier:

PDF, 339 KB

english, 2014

4

Uses and Biases of Volunteer Water Quality Data

Loperfido, J.V., Beyer, Pieter, Just, Craig L., Schnoor, Jerald L.

Journal:

Environmental Science & Technology

Année:

2010

Langue:

english

Fichier:

PDF, 867 KB

english, 2010

5

Fall predictors in older cancer patients: a multicenter prospective study

Vande Walle, Nathalie, Kenis, Cindy, Heeren, Pieter, Van Puyvelde, Katrien, Decoster, Lore, Beyer, Ingo, Conings, Godelieve, Flamaing, Johan, Lobelle, Jean-Pierre, Wildiers, Hans, Milisen, Koen

Journal:

Année:

2014

Langue:

english

Fichier:

PDF, 781 KB

english, 2014

6

[ECS 212th ECS Meeting - Washington, DC (October 7 - October 12, 2007)] ECS Transactions - Electrochemical Nucleation and Growth of Copper on Resistive Substrates

Radisic, Aleksandar, Boelen, Pieter, Rosenfeld, Aron, Hernandez, Jose Luis, Beyer, Gerald, Vereecken, Philippe

Année:

2008

Langue:

english

Fichier:

PDF, 584 KB

english, 2008

7

Clinical history and antithrombotic treatment of incidentally detected splanchnic vein thrombosis: a multicentre, international prospective registry

Riva, Nicoletta, Ageno, Walter, Schulman, Sam, Beyer-Westendorf, Jan, Duce, Rita, Malato, Alessandra, Santoro, Rita, Poli, Daniela, Verhamme, Peter, Martinelli, Ida, Kamphuisen, Pieter, Dentali, Franc

Journal:

The Lancet Haematology

Année:

2016

Langue:

english

Fichier:

PDF, 483 KB

english, 2016

8

A clinical decision rule and D-dimer testing to rule out upper extremity deep vein thrombosis in high-risk patients

van Es, Nick, Bleker, Suzanne M, Di Nisio, Marcello, Kleinjan, Ankie, Beyer-Westendorf, Jan, Camporese, Giuseppe, Kamphuisen, Pieter W, Büller, Harry R, Bossuyt, Patrick M

Journal:

Thrombosis Research

Année:

2016

Langue:

english

Fichier:

PDF, 548 KB

english, 2016

9

Safety and Feasibility of a Diagnostic Algorithm Combining Clinical Probability, d -Dimer Testing, and Ultrasonography for Suspected Upper Extremity Deep Venous Thrombosis

Kleinjan, Ankie, Di Nisio, Marcello, Beyer-Westendorf, Jan, Camporese, Giuseppe, Cosmi, Benilde, Ghirarduzzi, Angelo, Kamphuisen, Pieter W., Otten, Hans-Martin, Porreca, Ettore, Aggarwal, Anita, Brodm

Journal:

Annals of Internal Medicine

Année:

2014

Langue:

english

Fichier:

PDF, 141 KB

english, 2014

10

[IEEE 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2016.11.30-2016.12.3)] 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - 3D IC assembly using thermal compression bonding and wafer-level underfill — Strategies for quality improvement and throughput enhancement

Wang, Teng, Bex, Pieter, Capuz, Giovanni, Duval, Fabrice, Inoue, Fumihiro, Gerets, Carine, Bertheau, Julien, Rebibis, Kenneth June, Miller, Andy, Beyer, Gerald, Beyne, Eric, Natsukawa, Masanori, Mitsu

Année:

2016

Fichier:

PDF, 601 KB

2016

11

[IEEE 2016 6th Electronic System-Integration Technology Conference (ESTC) - Grenoble, France (2016.9.13-2016.9.15)] 2016 6th Electronic System-Integration Technology Conference (ESTC) - On the feasibility of die-to-wafer inorganic dielectric bonding

Teng Wang,, Podpod, Arnita, Capuz, Giovanni, Peng, Lan, Phommahaxay, Alain, Inoue, Fumihiro, Bex, Pieter, Dubey, Vikas, Rebibis, Kenneth June, Miller, Andy, Beyer, Gerald, Beyne, Eric

Année:

2016

Langue:

english

Fichier:

PDF, 769 KB

english, 2016

12

Context-based behaviour modelling and classification of marine vessels in an abalone poaching situation

Dabrowski, Joel Janek, de Villiers, Johan Pieter, Beyers, Conrad

Journal:

Engineering Applications of Artificial Intelligence

Année:

2017

Langue:

english

Fichier:

PDF, 2.29 MB

english, 2017

13

Naïve Bayes Switching Linear Dynamical System: A model for dynamic system modelling, classification and information fusion

Dabrowski, Joel Janek, de Villiers, Johan Pieter, Beyers, Conrad

Journal:

Information Fusion

Année:

2017

Langue:

english

Fichier:

PDF, 565 KB

english, 2017

14

[IEEE 2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) - Burlingame, CA (2017.10.16-2017.10.19)] 2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) - A novel in-situ resistance measurement to extract IMC resistivity and kinetic parameter for CoSn 3D stacks

Hou, Lin, Derakhshandeh, Jaber, De Coster, Jeroen, Wang, Teng, Cherman, Vladimir, Bex, Pieter, Rebibis, Kenneth June, Van De Plas, Geert, Beyer, Gerald, Beyne, Eric, De Wolf, Ingrid

Année:

2017

Langue:

english

Fichier:

PDF, 1.11 MB

english, 2017

15

[IEEE 2018 7th Electronic System-Integration Technology Conference (ESTC) - Dresden (2018.9.18-2018.9.21)] 2018 7th Electronic System-Integration Technology Conference (ESTC) - An in-situ resistance measurement to extract IMC resistivity and kinetic parameter of alternative metallurgies for 3D stacking

Hou, Lin, Derakhshandeh, Jaber, Radisic, Alex, Honore, Mia, De Coster, Jeroen, Cherman, Vladimir, Bex, Pieter, Rebibis, Kenneth June, Beyer, Gerald, Beyne, Eric, De Wolf, Ingrid

Année:

2018

Langue:

english

Fichier:

PDF, 34 KB

english, 2018

16

[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Enabling Ultra-Thin Die to Wafer Hybrid Bonding for Future Heterogeneous Integrated Systems

Phommahaxay, Alain, Suhard, Samuel, Bex, Pieter, Iacovo, Serena, Slabbekoorn, John, Inoue, Fumihiro, Peng, Lan, Kennes, Koen, Sleeckx, Erik, Beyer, Gerald, Beyne, Eric

Année:

2019

Langue:

english

Fichier:

PDF, 1.11 MB

english, 2019

17

[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Advances in Temporary Carrier Technology for High-Density Fan-Out Device Build-up

Podpod, Arnita, Phommahaxay, Alain, Bex, Pieter, Slabbekoorn, John, Bertheau, Julien, Salahoueldhadj, Abdellah, Sleeckx, Erik, Miller, Andy, Beyer, Gerald, Beyne, Eric, Guerrero, Alice, Yess, Kim, Arn

Année:

2019

Langue:

english

Fichier:

PDF, 1012 KB

english, 2019

18

[IEEE 2019 International Wafer Level Packaging Conference (IWLPC) - San Jose, CA, USA (2019.10.22-2019.10.24)] 2019 International Wafer Level Packaging Conference (IWLPC) - Novel Temporary Bonding and Debonding Solutions Enabling an Ultrahigh Interonnect Density Fo-Wlp Structure Assembly with Quasi-Zero Die Shift

Podpod, Arnita, Miller, Andy, Beyer, Gerald, Beyne, Eric, Guerrero, Alice, Liu, Xiao, Wu, Qi, Yess, Kim, Arnold, Kim, Phommahaxay, Alain, Bex, Pieter, Kennes, Koen, Bertheau, Julien, Arumugam, Harihar

Année:

2019

Fichier:

PDF, 656 KB

2019

19

[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Demonstration of a collective hybrid die-to-wafer integration

Suhard, Samuel, Phommahaxay, Alain, Kennes, Koen, Bex, Pieter, Fodor, Ferenc, Liebens, Maarten, Slabbekoorn, John, Miller, Andy, Beyer, Gerald, Beyne, Eric

Année:

2020

Fichier:

PDF, 995 KB

2020

20

[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Introduction of a New Carrier System for Collective Die-to-Wafer Hybrid Bonding and Laser-Assisted Die Transfer

Kennes, Koen, Phommahaxay, Alain, Guerrero, Alice, Bauder, Olga, Suhard, Samuel, Bex, Pieter, Iacovo, Serena, Liu, Xiao, Schmidt, Thomas, Beyer, Gerald, Beyne, Eric

Année:

2020

Fichier:

PDF, 789 KB

2020

21

[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Development of compression molding process for Fan-Out wafer level packaging

Julien, Bertheau, Fabrice F.C., Duval, Tadashi, Kubota, Pieter, Bex, Koen, Kennes, Alain, Phommahaxay, Arnita, Podpod, Eric, Beyne, Andy, Miller, Gerald, Beyer

Année:

2020

Fichier:

PDF, 831 KB

2020

22

[IEEE 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) - TÃ¸nsberg, Vestfold, Norway (2020.9.15-2020.9.18)] 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) - Process development and characterization of 3D multi-die stacking

Gerets, Carine, Derakhshandeh, Jaber, Bex, Pieter, Lofrano, Melina, Cherman, Vladimir, Fodor, Ferenc, De Wolf, Ingrid, Rebibis, Kenneth June, Beyer, Gerald, Miller, Andy, Beyne, Eric

Année:

2020

Fichier:

PDF, 4.33 MB

2020